| 摘要 |
PROBLEM TO BE SOLVED: To obtain a highly reliable multilayer wiring board which can prevent via-hole conductors from causing a resistance change even under a high-humidity environmental condition by preventing the instruction of moisture into the board through an interface between conductor wiring layers and insulating layers by improving adhesion between the layers. SOLUTION: This multilayer wiring board is provided with the insulating layers 1 containing at least a thermosetting resin, respectively, the conductor wiring layers 2 buried in the surfaces of the layers 1, and the via-hole conductors 3 which are filled with conductor component containing metallic powder into through holes for connecting the wiring layers 2 to each other. The cross sections of the wiring layers 2 connected with the conductors 3 are formed in inverted trapezoids having formed angles (θ) of 45-80 deg. and side faces having surface roughness (Ra) of >=0.2μm. In addition, an organic matter containing a hydrophilic group and a hydrophobic group is interposed between the contact faces of the wiring layers 2 and insulating layers 1 on the side faces of the wiring layers 2. |
