发明名称 |
DIRECTED PURGE FOR CONTACT FREE DRYING OF WAFERS |
摘要 |
The present invention generally provides a method and apparatus for processing a substrate in a wet processing chamber. One embodiment of the present invention provides an apparatus for processing a substrate. The apparatus comprises a gas delivery assembly disposed outside the chamber. The gas delivery assembly directs a gas towards areas where a substrate support contacts the substrate. |
申请公布号 |
WO2007016196(A3) |
申请公布日期 |
2007.04.19 |
申请号 |
WO2006US29103 |
申请日期 |
2006.07.26 |
申请人 |
APPLIED MATERIALS, INC.;MIMKEN, VICTOR;LU, YONGQIANG |
发明人 |
MIMKEN, VICTOR;LU, YONGQIANG |
分类号 |
H01L21/302;B08B3/10;B08B5/00;H01L21/461 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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