| 摘要 |
PROBLEM TO BE SOLVED: To attach simply a heat sink to a printed board independently of the thickness of an LSI mounted to the printed board. SOLUTION: In a mounting structure and fastening tools of an electronic component having a heat sink, a female screw 14 is formed by laminating and joining a female metal fitting 14b on the top surface of column gel 14a. Also, the rear surface of the column gel 14a is jointed to the side of a printed board (its upper stiffener 5). The end of a male screw 13 is passed through a through hole 3c of a heat-sink base 3a, and inserted helically into the female screw 14 fastened to the upper stiffener 5. As the helical insertion proceeds, the female screw 14 is lifted, and the column gel 14a stretched and extended. Since the restoring force of the column gel 14a is generated when it is extended, a heat sink 3 is stretched to the side of an LSI package 2 by the female screw 14. As a result, since the heat sink 3 can apply a load to the LSI package 2, the heat sink 3 can be subjected efficiently to the thermal contacting with the LSI package 2. Further, the column gel 14a absorbs the variation of the height of the LSI package 2 by the restoring force, while fastening the heat sink 3 to the LSI package 2. COPYRIGHT: (C)2008,JPO&INPIT |
