| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface protection sheet capable of preventing wash water from reaching a circuit surface when the sheet for surface protection is used by preventing a ring-shaped both-sided adhesive sheet from deforming when a laminate formed by temporarily sticking and supporting the sheet for surface protection composed of a base material and the ring-shaped both-sided adhesive sheet on a release sheet is wound into a winding body or when many sheets for surface protection are stacked. SOLUTION: Disclosed is a support structure 11 of the sheet for surface protection 10 to be used when the reverse surface of a semiconductor wafer is ground, the support structure 11 of the sheet for surface protection 10 having a structure such that the sheet for surface protection 10 having, on one surface of a base material sheet 1, an opening portion which has a diameter smaller than the external diameter of the semiconductor wafer to be stuck and where an adhesive layer 2 is not formed and the adhesive layer 2 enclosing the opening portion is supported on the release sheet 4 made of a resin film of≥70μm in thickness temporarily stuck on the adhesive layer of the sheet for surface protection. COPYRIGHT: (C)2009,JPO&INPIT
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