| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board having a stuck structure, which can reduce stress applied to a bump after being mounted on a mounting substrate, then, has improved mounting reliability. SOLUTION: The wiring board 10 has at least a first substrate 11 having a function element on one surface, a second substrate 16 provided on one surface side of the first substrate through a first sealing portion 17, and the bump 19 which is provided on the other surface side of the first substrate and electrically connected to the function element. The first sealing portion is provided in a first region forming an outer periphery of the first substrate, and disposed at a position not overlapping a bump joining portion when viewed from the direction where the first and second substrate overlap each other. COPYRIGHT: (C)2009,JPO&INPIT
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