| 摘要 |
An apparatus for processing a wafer is provided to improve the apparatus operation rate by operating continuously the other processing unit while repairing the processing unit. The processing apparatus(100) comprises a loading unit(110), a measuring unit(120), and a processing unit(131, 132) and a cleaning unit(141, 142). The loading unit is comprised in order to load three cassettes. If the wafer is loaded in the loading unit, the robot catches the wafer and moves to the measuring unit. The measuring unit measures the physical variable including a diameter and a center value of wafer. The processing unit is arranged to be symmetrical around the measuring unit and the processing unit processes wafer. The processing unit performs the processing of the wafer transferred from the measuring unit. The rotating arms(151,152) are positioned between the measuring unit and the processing unit. The rotating arm transfers the wafer to the processing unit from the measuring unit. The cleaning unit is adjacent to the processing unit and washes the wafer.
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