| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern correction method of high precision of not requiring precise positioning of a pattern correction part, nor trimming after transfer of a film for correction by solving a failure of the pattern correction method using a conventional film transfer system, and to provide a pattern correction apparatus. <P>SOLUTION: In the pattern correction method for correcting the pattern defect part of a substrate front surface, a pattern defect is corrected by previously forming a tape-like correction film formed by patterning a correction ink film on a film, and transferring the correction ink film by heating to the pattern defect part. The correction film is formed by applying ink for correction on an ink releasable base material, and putting the ink in a preliminary dry state, then bringing a non-pattern region into contact with a removal plate to form the necessary pattern as a recessed part and to transfer the non-pattern region to a plate convex part, thereby forming the correct ink film patterned on the ink releasable base material. The pattern is further transferred and formed on the correction film by using pressurization transfer. <P>COPYRIGHT: (C)2009,JPO&INPIT |
