发明名称 |
Curable resin composition and cured product thereof, encapsulating agent, and optical semiconductor device |
摘要 |
Provided is a curable resin composition capable of forming a cured product that excels in heat resistance, transparency, and flexibility and particularly excels in barrier properties against a corrosive gas (e.g., sulfur oxide).;The curable resin composition includes a compound (U) containing an aliphatic carbon-carbon unsaturated bond and a compound (H) containing a hydrosilyl group and includes at least one of a ladder-type silsesquioxane [A1] and a ladder-type silsesquioxane [A2], where the ladder-type silsesquioxane [A1] contains an aliphatic carbon-carbon unsaturated bond and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard, and the ladder-type silsesquioxane [A2] contains a hydrosilyl group and has a number-average molecular weight of 500-1500 and a molecular weight dispersity (Mw/Mn) of 1.00-1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard. |
申请公布号 |
US9447277(B2) |
申请公布日期 |
2016.09.20 |
申请号 |
US201314395016 |
申请日期 |
2013.05.17 |
申请人 |
DAICEL CORPORATION |
发明人 |
Kamuro Shigeaki;Kuwana Akihiro;Harada Nobuhiko |
分类号 |
C08L83/04;H01L23/29;C09K3/10;H01L33/56;C08K5/5425;C08G77/12;C08G77/20;C08K5/3492;C08G77/50 |
主分类号 |
C08L83/04 |
代理机构 |
Birch, Stewart, Kolasch & Birch, LLP |
代理人 |
Birch, Stewart, Kolasch & Birch, LLP |
主权项 |
1. A curable resin composition comprising:
a compound (U) containing an aliphatic carbon-carbon unsaturated bond; and a compound (H) containing a hydrosilyl group; the compound (U) being at least one ladder-type silsesquioxane [A1] containing an aliphatic carbon-carbon unsaturated bond and having a number-average molecular weight from 500 to 1500 and a molecular weight dispersity (Mw/Mn) from 1.00 to 1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard; and optionally further comprising at least one compound selected from the group consisting of:
a ladder-type silsesquioxane [B1] containing an aliphatic carbon-carbon unsaturated bond, other than the ladder-type silsesquioxane [A1];a linear or branched silicone [C1] containing an aliphatic carbon-carbon unsaturated bond; anda cyclic siloxane [E1] containing an aliphatic carbon-carbon unsaturated bond; the compound (H) being at least one ladder-type silsesquioxane [A2] containing a hydrosilyl group and having a number-average molecular weight from 500 to 1500 and a molecular weight dispersity (Mw/Mn) from 1.00 to 1.40 as determined by gel permeation chromatography and calibrated with a polystyrene standard; and optionally further comprising at least one compound selected from the group consisting of:
a ladder-type silsesquioxane [B2] containing a hydrosilyl group, other than the ladder-type silsesquioxane [A2];a linear or branched silicone [C2] containing a hydrosilyl group; anda cyclic siloxane [E2] containing a hydrosilyl group; the curable resin composition further comprising an isocyanuric acid compound [D] represented by Formula (d-2):wherein R32 represents a monovalent group containing an aliphatic carbon-carbon unsaturated bond; and R33 is, in each occurrence identically or differently, selected from a hydrogen atom and a C1-C8 linear or branched alkyl group. |
地址 |
Osaka JP |