发明名称 |
PHOTO/MOISTURE CURABLE RESIN COMPOSITION, ADHESIVE FOR ELECTRONIC COMPONENTS, AND ADHESIVE FOR DISPLAY ELEMENTS |
摘要 |
A purpose of the present invention is to provide a photo/moisture curable resin composition which has excellent coatability, shape retainability, adhesiveness and gap retainability. Another purpose of the present invention is to provide an adhesive for electronic components and an adhesive for display elements, each of which is obtained using the photo/moisture curable resin composition. The present invention is a photo/moisture curable resin composition which contains a radically polymerizable compound, a photo/moisture curable resin, a radical photopolymerization initiator, and spacer particles. |
申请公布号 |
WO2016163353(A1) |
申请公布日期 |
2016.10.13 |
申请号 |
WO2016JP61102 |
申请日期 |
2016.04.05 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
KIDA, Takumi;TAKAHASHI, Toru;YUUKI, Akira;MIKI, Takashi;SAITO, Masashi;HIRATSUKA, Takaichi;WANG, Xiaoge |
分类号 |
C08G18/10;C08F2/44;C08F2/48;C09J4/00;C09J11/04;C09J11/06;C09J175/04 |
主分类号 |
C08G18/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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