发明名称 COMPOSITION CONTAINING SILVER ULTRAFINE PARTICLES AND CONDUCTIVE PATTERN MANUFACTURING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide manufacturing method of a composition containing silver ultrafine particles and a conductive pattern which do not need sintering process and dipping treatment. <P>SOLUTION: The composition containing silver ultrafine particles contains the silver ultrafine particles with an average particle diameter of 0.1 &mu;m and under, polymeric latex, and water-soluble halide in an aqueous medium. And the manufacturing method of the conductive pattern includes pattern making by applying and drying the composition containing silver ultrafine particles on surfaces of base materials and by ultraviolet ray irradiation and/or re-feeding of moisture to the pattern. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011159392(A) 申请公布日期 2011.08.18
申请号 JP20100017718 申请日期 2010.01.29
申请人 MITSUBISHI PAPER MILLS LTD 发明人 NISHIMURA NAOYA;SHINO SHIGEKI
分类号 H01B1/22;B22F1/00;B22F9/00;B22F9/24;H01B1/00;H01B13/00;H01L21/28;H01L21/288;H01L21/3205;H01L23/52;H05K3/12 主分类号 H01B1/22
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