| 摘要 |
A multi-chip module (10) and a method for manufacturing the multi-chip module (10). A first semiconductor chip (40) is mounted to a support substrate (12) and a second semiconductor chip (50) is mounted to the first semiconductor chip (40). The second semiconductor chip (50) has a smaller dimension (51) than the first semiconductor chip (40). A spacer (60) is coupled to the second semiconductor chip (50). Bonding pads on the first (40) and second (50) semiconductor chips are wirebonded to bonding pads (18, 19, 20, 21) on the support substrate (12). A third semiconductor chip (80) is mounted to the spacer (60) and bonding pads (86) on the third semiconductor chip (80) are wirebonded to bonding pads (18, 19, 20, 21) on the support substrate (12). |
