| 摘要 |
<p>A reflow treatment apparatus and a reflow treatment method are provided to obtain a sufficient yield by performing a uniform treatment process within a surface of a substrate. A reflow treatment apparatus is used for softening and floating a resist layer on a substrate under solvent environment. A substrate supporting member is formed to support the substrate including the resist layer at a horizontal stance. A solvent environment forming unit is installed relatively, movably, and closely with respect to the substrate supported by the substrate supporting member, in order to form the solvent environment in a space of an upper part of the substrate. The solvent environment forming unit includes a solvent supply hole(55) and a solvent absorbing hole(57).</p> |
