| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface treating device which can prevent processing liquid from scattering with respect to a surface, other than the surface to be treated and perform processing on only the surface to be treated that uses the processing liquid. SOLUTION: A surface treating implement 1 is equipped with a processing liquid collection section 13, which has an annular groove 10 formed on an opposed surface 1a opposed to the surface 50a of a semiconductor wafer to be treated and has a through-hole 11, formed so as to communicate with the groove 10 and collecting processing liquid. COPYRIGHT: (C)2009,JPO&INPIT
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