发明名称 |
PLATING BATH COMPOSITION AND METHOD FOR ELECTROLESS PLATING OF PALLADIUM |
摘要 |
The present invention relates to an aqueous plating bath composition and a method for depositing a palladium layer by electroless plating onto a substrate. The aqueous plating bath composition according to the present invention comprises a source for palladium ions, a reducing agent for palladium ions and an aromatic compound. The aqueous plating bath composition has an increased deposition rate for palladium while maintaining bath stability. The aqueous plating bath composition has also a prolonged life time. The aromatic compounds of the present invention allow for adjusting the deposition rate to a constant range over the bath life time and for electrolessly depositing palladium layers at lower temperatures. The aromatic compounds of the present invention activate electroless palladium plating baths having a low deposition rate and reactivate aged electroless palladium plating baths. |
申请公布号 |
WO2016097083(A2) |
申请公布日期 |
2016.06.23 |
申请号 |
WO2015EP80136 |
申请日期 |
2015.12.17 |
申请人 |
ATOTECH DEUTSCHLAND GMBH |
发明人 |
WALTER, ANDREAS;MUSKULUS, KATHARINA |
分类号 |
C23C18/44 |
主分类号 |
C23C18/44 |
代理机构 |
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代理人 |
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