发明名称 |
Leadframe treatment for enhancing adhesion of encapsulant thereto |
摘要 |
A method is provided for treating a leadframe comprising copper or copper alloy to enhance adhesion of molding compound to it. The leadframe is oxidized in an oxidation treatment bath to form copper oxide on the surface of the leadframe. It is then dipped in a complexing or chelating agent to enhance the purity of the copper oxide formed. Thereafter, the leadframe is cleaned with an acid to remove any contaminants remaining on the leadframe.
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申请公布号 |
US8012886(B2) |
申请公布日期 |
2011.09.06 |
申请号 |
US20070683234 |
申请日期 |
2007.03.07 |
申请人 |
ASM ASSEMBLY MATERIALS LTD |
发明人 |
KWAN YIU FAI;CHAN TAT CHI;CHAN WAI;LEE CHI CHUNG |
分类号 |
H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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