INTEGRATED CIRCUIT BARRIERLESS MICROFLUIDIC CHANNEL

摘要

A structure and method for fabricating a continuous cooling channel in the back end of line wiring levels of an integrated circuit (IC) chip is provided. This continuous cooling channel may provide a path for a cooling source such as a fluid pumped from an external fluidic-cooling circulation driver to make physical contact locally with and cool the back end levels within the IC chip that may generate heat as a byproduct of the IC device's routine operations. Such a cooling structure is achieved by removing a horizontal portion of a barrier layer from an intermediate region of an interlevel interconnect structure, selective to a vertical portion of the barrier layer located on a sidewall of the interlevel interconnect structure, using gas cluster ion beam etching as well as removing the bulk conductor by additional means.

主权项

1. An integrated circuit chip having a continuous cooling channel extending through back end of the line (BEOL) of the chip comprising:
a pair of vertical channel openings extending through two or more dielectric layers in the back end of line of the chip, wherein each vertical channel opening has a bottom and a top; a horizontal channel opening connecting the pair of vertical channel openings at their bottoms; and a barrier layer having a vertical portion on a sidewall of each of the vertical channel openings and a horizontal portion,
wherein the horizontal portion of the barrier layer extends laterally into each of the vertical channel openings at a location where the dielectric layers meet, andwherein the horizontal portion extends only partially into the vertical channel opening such that a sidewall of the horizontal portion of the barrier layer is exposed; a pair of plugs at the top of the pair of vertical channel openings; and an electrical interconnect located adjacent to the channel opening, wherein the electrical interconnect includes one or more layers of a conductive material.