| 发明名称 |
SUBSTRATE PROCESSING APPARATUS |
| 摘要 |
The substrate processing apparatus includes a processing chamber including an outer chamber configured to hold a processing liquid and an inner chamber capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted. The guide cover is located below an upper end of the outer chamber and above the inner chamber. |
| 申请公布号 |
US2016284571(A1) |
申请公布日期 |
2016.09.29 |
| 申请号 |
US201615076265 |
申请日期 |
2016.03.21 |
| 申请人 |
EBARA CORPORATION |
发明人 |
KURASHINA Keiichi;YOKOYAMA Toshio |
| 分类号 |
H01L21/67;H01L21/673 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate processing apparatus comprising:
a substrate holder for holding a substrate; a processing chamber including an outer chamber configured to hold a processing liquid for processing the substrate, and an inner chamber housed in the outer chamber and capable of surrounding the substrate held by the substrate holder; a liquid delivery pipe having one end coupled to a bottom of the inner chamber and other end coupled to the outer chamber; a pump coupled to the liquid delivery pipe and configured to suck the processing liquid from the inner chamber through the liquid delivery pipe and to deliver the processing liquid to the outer chamber through the liquid delivery pipe; and a guide cover having a through-hole in which the substrate holder can be inserted, the guide cover being located below an upper end of the outer chamber and above the inner chamber. |
| 地址 |
Tokyo JP |
