| 发明名称 |
OLED packaging method and structure |
| 摘要 |
The present invention provides an OLED packaging method and structure. The method includes the following steps: providing an OLED substrate (1) and a package cover (4) and forming an alignment mark on the package cover (4); forming a circle of patternized desiccant layer (3) on the package cover (4); coating a circle of frame resin (5) on the package cover (4) at an outer side of the desiccant layer (3); attaching the package cover (4) and the OLED substrate (1) to each other; and subjecting the frame resin (5) to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate (1) with he package cover (4). |
| 申请公布号 |
US9466809(B2) |
申请公布日期 |
2016.10.11 |
| 申请号 |
US201414430200 |
申请日期 |
2014.09.11 |
| 申请人 |
Shenzhen China Star Optoelectronics Technology Co., Ltd |
发明人 |
Liu Yawei;Wang Yifan;Lo Changcheng |
| 分类号 |
H01L33/00;H01L51/52;H01L51/56;H01L23/544;H01L27/32 |
主分类号 |
H01L33/00 |
| 代理机构 |
|
代理人 |
Cheng Andrew C. |
| 主权项 |
1. An organic light emitting diode (OLED) packaging method, comprising the following steps:
(1) providing an OLED substrate and a package cover and forming an alignment mark on the package cover; (2) forming a circle of patternized desiccant layer on the package cover; (3) coating a circle of frame resin on the package cover at an outer side of the desiccant layer; (4) attaching the package cover and the OLED substrate to each other; and (5) subjecting the frame resin to irradiation of a UV light source or heating for curing so as to complete packaging of the OLED substrate with the package cover. |
| 地址 |
Shenzhen, Guangdong CN |
