| 发明名称 | Lead frame and semiconductor device | ||
| 摘要 | A lead frame includes an outer lead and a plating layer that covers a lower surface and side surfaces of the outer lead. The plating layer does not cover the upper surface of the outer lead. A frame base material is exposed from the plating layer at the upper surface of the outer lead. | ||
| 申请公布号 | US9466556(B2) | 申请公布日期 | 2016.10.11 |
| 申请号 | US201414221796 | 申请日期 | 2014.03.21 |
| 申请人 | Shinko Electric Industries Co., Ltd. | 发明人 | Sato Harunobu;Yoshie Takashi;Kurashima Susumu |
| 分类号 | H01L23/495;H01L21/48 | 主分类号 | H01L23/495 |
| 代理机构 | Fish & Richardson P.C. | 代理人 | Fish & Richardson P.C. |
| 主权项 | 1. A lead frame comprising: a frame base material including connection leads and a dam bar connecting the connection leads, wherein each connection lead includes an inner lead, which is located at an inner side of the dam bar, and an outer lead, which is located at an outer side of the dam bar; and a plating layer that covers either one of an upper surface and a lower surface of each outer lead and side surfaces of each outer lead, wherein the frame base material is exposed from the plating layer at the other one of the upper surface and the lower surface of each outer lead, the plating layer covering each side surface from a lower end to an upper end of the side surface. | ||
| 地址 | Nagano-shi, Nagano-ken JP | ||