METHOD FOR CONFIGURING AN OPTICAL MODULATOR

摘要

A method for manufacturing an electro-optically coupled switch in accordance with the present invention requires a sequential reconfiguration of a layer of semiconductor material. To begin, a base member is created wherein the semiconductor layer is positioned on a layer of insulator material with the insulator material positioned between the semiconductor layer and a semiconductor substrate. In sequence, with a first etch, the semiconductor layer is etched to create waveguides on opposite sides of a slot. In a second etch, the slot is deepened to expose the layer of insulator material in the slot. With a third contact pad doping process, pads can be positioned on top of the layer of insulator material for electrical contact with the respective waveguides. Metal contacts can then be placed on the contact pads, the slot can be filled with an electro-optical polymer and, if needed, the polymer can be poled.

主权项

1. An electro-optically coupled switch which comprises:
a base member having a length L, a width Ws, and a thickness T, wherein the base member defines a central plane located equidistant between opposed edges of the base member, and wherein the base member includes a layer of a semiconductor material and a layer of silicon, with a layer of a silica insulator positioned therebetween, wherein the semiconductor material has been modified by removing material therefrom to a depth d1 along the length L through a distance xe extending from each edge of the base member toward the central plane, and further wherein the semiconductor material has been modified by removing material therefrom to a depth d2 along the length L through a distance xc symmetrically centered on the central plane, to create a slot through the semiconductor material between opposed waveguides formed in the semiconductor material, wherein each waveguide has a width xw and a length L, and wherein d2>d1, and Ws=2xe+2xw+xc; a polymer cross-coupling material filling the slot; a pair of contact pads, wherein each contact pad extends through a distance xd from each edge of the base member for connection with a respective waveguide, wherein xd is less than xe (xd