发明名称 Processing chamber allocation setting device and processing chamber allocation setting program
摘要 Provided is a method that may quickly and simply select the allocation of the type of wafers to the processing chamber having a higher productivity in a semiconductor processing device in which a plurality of conveyance robots is disposed in a conveyance mechanism to which a processing chamber is connected and an object to be processed is delivered between the plurality of conveyance robots, when processings are performed on a plurality of types of wafers in parallel. From the information on the arrangement of the processing chambers of the semiconductor processing device and input type of wafers to be processed, the processing chamber allocation candidate is comprehensively generated and a simulation that manufactures all processing targets for each of the processing chamber allocation candidates is performed to calculate a productivity and the candidates are displayed in the order from a higher productivity to support the adoption of a user.
申请公布号 US9507328(B2) 申请公布日期 2016.11.29
申请号 US201313859812 申请日期 2013.04.10
申请人 HITACHI HIGH-TECHNOLOGIES CORPORATION 发明人 Nakata Teruo;Nogi Keita;Inoue Satomi
分类号 G05B15/02;G05B19/418 主分类号 G05B15/02
代理机构 Baker Botts L.L.P. 代理人 Baker Botts L.L.P.
主权项 1. A processing chamber allocation setting device which evaluates allocation of processing chambers for a plurality of types of objects to be processed in advance in a semiconductor processing device having a structure in which a plurality of conveyance chambers is provided and the conveyance chambers are connected to the processing chambers while being connected to each other directly or with a delivery intermediate chamber of the object to be processed interposed therebetween, the device comprising: a processing chamber allocation candidate generating unit which is configured to calculate all processing chamber allocation number candidates which allocates at least one processing chamber to each one of the plurality of types of objects to be processed, create one processing chamber allocation candidate which allocates the each one of the plurality of types of objects to be processed to each of the processing chambers for each of the calculated processing chamber allocation number candidates, and in an arbitrary pair of the processing chambers of the one processing chamber allocation candidate for which each processing chamber of the arbitrary pair is allocated to a different type of object, replace the types of allocated objects to be processed among the arbitrary pair of processing chambers for the one processing chambers in order to search a new processing chamber allocation candidate to generate all combinations of processing chamber allocation candidates, and a processing completed time calculating unit which is configured to virtually reproduce a plurality of a series of manufacturing processes, each of which conveys one of the processing targets designated by a user in accordance with each of the processing chamber allocation candidates from a load port where the processing target is stored to a corresponding processing chamber of the semiconductor processing device to perform a predetermined processing and thereafter to return the processing target from the corresponding processing chamber to the load port, on a calculator, to calculate a processing completed time from an initial processing starting time of all objects to be processed, which are processing targets, to a processing completed time of the last object to be processed for every processing chamber allocation candidate.
地址 Tokyo JP