发明名称
摘要 <p>PURPOSE: To facilitate the assembling of an electronic component and to decrease the manufacturing cost. CONSTITUTION: The third step has a pressure part which pushes and fixes a micro-inductor and a resistor to a jig temporarily, and a binding part which binds a leg RL of the resistor to a leg LL of the micro-inductor. The pressure part has a pushing block. Furthermore, the binding part has a hollow-tube state binding shaft 322 having an engaging pawl at the end part. At first, the micro-inductor L and the resistor are pushed by the pushing block, and an engaging pawl 322 is brought close to the leg RL with the leg LL of the micro- inductor being inserted into the binding shaft. Then, the binding shaft 322 is rotated, and the engaging pawl 323 is engaged on the leg RL. When the shaft is further rotated, the leg RL is bent at the intersecting part with the leg LL. When the shaft is rotted by about one rotation, the leg RL and the leg LL are bound. Thereafter, in the fourth step, flux is supplied to the bound part, and soldering is performed in the fifth step.</p>
申请公布号 JP2958611(B2) 申请公布日期 1999.10.06
申请号 JP19950006505 申请日期 1995.01.19
申请人 TOKYO TOKUSHU DENSEN KK 发明人 KONDO HISASHI
分类号 H01C17/00;(IPC1-7):H01C17/00 主分类号 H01C17/00
代理机构 代理人
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