发明名称
摘要 An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.
申请公布号 JP2011525052(A) 申请公布日期 2011.09.08
申请号 JP20110514616 申请日期 2009.06.18
申请人 发明人
分类号 H01L23/36;H05K7/20 主分类号 H01L23/36
代理机构 代理人
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