| 摘要 |
<p>An optical constant calculation method capable of calculating an accurate optical constant of an underlayer film to accurately identify a substrate surface structure. After each of films is layered on a wafer, there are measured the reflectivity of an oxide film under which an organic insulation film is formed and the reflectivity of an organic insulation film exposed after removal by plasma of the oxide film. Based on the measured reflectivities, the optical constant of the organic insulation film after being altered by heat treatment and the optical constant of the organic insulation film after being altered by plasma are calculated.</p> |
