| 发明名称 |
SEMICONDUCTOR PACKAGES AND METHODS FOR FABRICATING THE SAME |
| 摘要 |
A semiconductor package comprising: a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a first protrusion extending beyond a perimeter of the semiconductor chip and extending towards the connection pillar. |
| 申请公布号 |
US2016204080(A1) |
申请公布日期 |
2016.07.14 |
| 申请号 |
US201514958928 |
申请日期 |
2015.12.03 |
| 申请人 |
KIM Jae Choon;KIM Donghan;SONG Jikho;UMEMOTO Mitsuo;CHOI Inho |
发明人 |
KIM Jae Choon;KIM Donghan;SONG Jikho;UMEMOTO Mitsuo;CHOI Inho |
| 分类号 |
H01L25/065;H01L25/00;H01L23/495;H01L21/48;H01L23/367;H01L23/31 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor package comprising:
a semiconductor chip; a connection pillar that is disposed adjacent to the semiconductor chip; a first heat dissipation layer disposed on the semiconductor chip; and a second heat dissipation layer disposed on the first heat dissipation layer, the second heat dissipation layer including a body and a first protrusion projecting toward the connection pillar from a sidewall of the body. |
| 地址 |
Incheon KR |
