| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor module that monitors failure symptoms.SOLUTION: A semiconductor module includes: a substrate; first wiring disposed on the substrate; an electrode pad connected to the first wiring; a joining section disposed on the electrode pad; an oscillation section being connected to the first wiring and being capable of oscillating a predetermined voltage signal; a detection section capable of detecting the predetermined voltage signal; and an analysis section determining a deterioration state of the joining section on the basis of a voltage value of the detection voltage signal detected via the first wiring. The analysis section of the semiconductor module determines the deterioration state of the joining section on the basis of a correspondence information table where a plurality of corresponding relations among the deterioration states of the joining section and voltage values of the detection voltage signals. |
