| 摘要 |
PROBLEM TO BE SOLVED: To obtain a non-contact semiconductor card where a coil for input/ output can be properly fixed in a card base body and which has a high operation reliability. SOLUTION: With respect to the semiconductor card where a substrate 2 and electronic parts 1 mounted on the substrate 2 are buried in a card base body 3, the card base body 3 has at least a first forming part 3a and a second forming part 3b, and the second forming part 3b holds the substrate 2 and regulate at least the thickness of the semiconductor card. The first forming part 3a is provided adjacently to the second forming part 3b and forms the external shape of the semiconductor card together with the second forming part 3b. Thus, the substrate 2 and electronic parts 1 are buried in the card base body 3. |
