| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting a chip with high workability by picking up the chip and recognizing the position thereof at high speed. SOLUTION: A head 20 holds a plurality of nozzles 21a-21c arranged laterally in a row. The head 20 is moved linearly above a part feeder in the carrying direction of board and chips 12 of different size are picked up sequentially by means of respective nozzles 21a-21c. Subsequently, the head 20 is moved linearly above the line sensor 37 of an optical unit 30 in the carrying direction of board and the position of the chips 12 chucked to respective nozzles 21a-21c is recognized continuously. Thereafter, positional shift of the chip 12 is corrected in the X, Y and θ directions according to the recognition results and the chips 12 are mounted sequentially at specified coordinate positions on a board. |
