POLISHING LIQUID COMPOSITION

摘要

PROBLEM TO BE SOLVED: To obtain a polishing liquid composition excellent in the surface smoothness of a polished material after polishing and moreover capable of polishing at an economical speed without causing a surface discontinuity such as a projection and a damage by polishing for the finishing polishing of a memory hard disk or the polishing of a semiconductor element. SOLUTION: This polishing liquid composition is obtained by mixing a polishing material (B) and water and has 1.3-3.0 ratio (D90/D50) of the particle size of the polishing material (D90) at which the integrated particle size distribution (based on particle number) of the polishing material from the smaller particle size side reaches 90% to the particle size (D50) at which the integrated particle size distribution reaches 50% and 10-600 nm of the D50. Besides, the polishing liquid composition is obtained by mixing two or more kinds of polishing materials having different particle sizes (D50) an water and has 1.1-3.0 ratio (D50L/D50S) of the D50 value (D50L) o the polishing material (B) having the largest D50 value to the D50 value (D50S) of the polishing material (A) having the smallest D50 value and (90/10) to (10/90) compounded ratio [A/B (weight ratio)] of polishing materials A and B.