发明名称 METHOD FOR SEALING PACKAGE, METHOD FOR MANUFACTURING ELECTRONIC ELEMENT MODULE, APPARATUS FOR SEALING AND PACKAGE ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a method and an apparatus for sealing a package capable of improving productivity, reliability, functional characteristics or the like without lowering a performance of an article to be contained. SOLUTION: The method for sealing the package comprises the steps of fixing a housing 10 for containing a crystal oscillator piece 12 to a lid 14 made of a laser beam transmissible material via an adhesive member 16, radiating the beam to the member 16 through the lid 14 to melt the member 16, and connecting the housing 10 to the lid 14 via the member 16.
申请公布号 JP2001326290(A) 申请公布日期 2001.11.22
申请号 JP20010051938 申请日期 2001.02.27
申请人 SEIKO EPSON CORP 发明人 AMAKO ATSUSHI;UMETSU KAZUNARI;TANAYA HIDEO
分类号 H01L23/02;B65B51/22;H01L23/10;H03H3/02;H03H9/10;(IPC1-7):H01L23/02 主分类号 H01L23/02
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