| 摘要 |
PURPOSE: A method for manufacturing a PCB is provided to reduce manufacturing processes by only forming three cutting bores for connection slices connecting divided substrates. CONSTITUTION: A central portion of a substrate(50) having a predetermined size is divided into adequate sizes. The divided substrates(61) are inter-connected with a connection slice. Three cutting bores(55a) are formed on each of the connection slice so as to be parallel with a surface of the divided substrates. A semiconductor element(65) is mounted on the divided substrates. A side connection plate, which connects side portions of the divided substrates, is cut to separate the connection slice from the divided substrate.
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