WAFER LEVEL CHIP SCALE PACKAGE OF IMAGE SENSOR, AND METHOD OF MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a wafer level chip scale package of an image sensor and to provide a method of manufacturing the same.

SOLUTION: A wafer level chip scale package of an image sensor of the present invention includes: a wafer 10 having an image sensor 11 and a pad 12 on an upper surface and having an inclined surface on both side end portions; an extended pad 17 formed extending from the top of the pad 12 to the top of the inclined surface of the wafer, with its bottom surface formed on the same plane as the bottom surface of the wafer, so as to be electrically connected to the pad 12; a support part 19 formed on the extending pad 17 so as to support both side portions of a bottom surface of glass and have a height capable of securing a space, being an air cavity 18; and a glass 20 fixed to the top of the support part 19 so as to form the air cavity 18 on the top of the wafer 10.

COPYRIGHT: (C)2008,JPO&INPIT