| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treatment apparatus and a substrate treatment method which can realize stabilization of plating liquid. SOLUTION: The substrate treatment apparatus includes a plating treating vessel 10 for applying an electroless plating to the surface of a substrate, a plating liquid supplying vessel 12 for supplying plating liquid to the plating treating vessel 10, a plating liquid circulating line 22 for circulating the plating liquid in the plating liquid supplying vessel 12, a plating liquid branching and circulating line 30 for selectively branching the plating liquid from the plating liquid circulating line 22 and joining it together with the plating liquid circulating line based on the detection values of a pH detector 34 arranged in the plating liquid supplying vessel 12. The plating liquid branching and circulating line 30 is provided with an auxiliary reaction unit 32 having therein an auxiliary reactant causing the same electroless plating reaction as that of the surface of the substrate. COPYRIGHT: (C)2009,JPO&INPIT
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