A SUBSTRATE ARRANGEMENT AND A METHOD OF MANUFACTURING A SUBSTRATE ARRANGEMENT

摘要

According to one embodiment of the present invention, a substrate arrangement is provided. The substrate arrangement includes a first substrate; a second substrate positioned above the first substrate, the second substrate comprising a first through hole; a third substrate positioned above the second substrate, the third substrate comprising a second through hole; a first electrically conductive interconnect pillar positioned on the first substrate and extending from the first substrate through the first through hole to electrically contact the third substrate; and a second electrically conductive interconnect pillar positioned on the second substrate and extending from the second substrate through the second through hole. A method of manufacturing a substrate arrangement is also provided.