MATERIAL DEPOSITION ARRANGEMENT, A VACUUM DEPOSITION SYSTEM AND METHOD FOR DEPOSITING MATERIAL

摘要

A material deposition arrangement (100) for depositing evaporated material on a substrate (121) in a vacuum chamber (110) is described. The material deposition arrangement includes a crucible (102; 102a; 102b) for providing material to be evaporated; a linear distribution pipe (106; 106a; 106b) being in fluid communication with the crucible (102; 102a; 102b); and a plurality of nozzles in the distribution pipe (106; 106a; 106b) for guiding the evaporated material into the vacuum chamber (110). Each nozzle (400) may have a nozzle inlet (401) for receiving the evaporated material, a nozzle outlet (403) for releasing the evaporated material to the vacuum chamber, and a nozzle passage (402) between the nozzle inlet (401) and the nozzle outlet (403). The nozzle passage (402) of at least one of the plurality of nozzles includes a first section (410) having a first section length (412) and a first section size (411), and a second section (420) having a second section length (421) and a second section size (421). The ratio of the second section size (421) to the first section size (411) is between 2 and 10.