| 摘要 |
A cooling manifold and a method for manufacturing the cooling manifold are provided. The cooling manifold includes a housing that defines an interior region having a serpentine flow path therein. The housing has a first plurality of grooves extending from a first surface of the housing into the housing. The grooves do not fluidly communicate with the interior region. The first plurality of grooves receive a portion of a thermally conductive member therein to conduct heat energy from the thermally conductive member to the housing. The cooling manifold further includes a top cap configured to seal a first end of the housing and a bottom cap configure to seal a second end of the housing. |
