| 摘要 |
An electronic-device-sealing resin composition and an organic EL element that include, as a cross-linking metal-organic drying agent, a metal-complex compound that has, as a ligand, a cross-linking alkoxide that is represented by general formula (1). General formula (1): M(ORx)n. In general formula (1), M represents Al, B, Ti, or Zr, the Rx of the ligand represents an alkyl group, an alkenyl group, an aryl group, a cycloalkyl group, a heterocyclic group, an acyl group, or a group represented by general formula (a), at least one Rx is a cross-linking group, and n represents the valence of M. In general formula (a), O* represents the O of the ORx in general formula (1), R1 represents an alkyl group, an alkenyl group, or an acyl group, R2 represents a hydrogen atom or an alkyl group, and R3 represents an alkyl group or an alkoxy group. |
