| 摘要 |
Provided is a small high-frequency module by which it is possible to mitigate the effects of heat generated by high-frequency components while mitigating mutual interference between the high-frequency components. This high-frequency module 10 is characterized by being provided with the following: a substrate 20 in which a hole 21 is formed; a metal block 30, the top of which has formed therein a plurality of recesses 31; and a plurality of high-frequency components 40 that are disposed, respectively, in the plurality of recesses 31, the metal block 30 being embedded in the hole 21 of the substrate 20. |
