SOLDERING NOZZLE FOR DELIVERING MOLTEN SOLDER TO UNDERSURFACE OF PCB AND METHOD FOR REDUCING DEGREE OF OCCURRENCE OF DEWETTING IN SOLDER NOZZLE

摘要

PROBLEM TO BE SOLVED: To provide an improved soldering nozzle for delivering molten solder to an undersurface of a PCB.SOLUTION: Nozzles 61 and 81 comprises nozzle outlets and an inner bore through which a flow of molten solder can be delivered to overflow the nozzle outlet, the nozzles having an outer surface configured to collect a return flow of the molten solder. The outer surface of the nozzles 61 and 81 comprises a slotted or recessed feature, located around at least a part of the nozzle outlet. This feature accommodates at least a part of the return flow of the molten solder. The soldering nozzles 61 and 81 achieve improved dryness performance.SELECTED DRAWING: Figure 28