发明名称 |
ELEKTRISCHE VERBINDUNGSSTRUKTUR UND VERFAHREN ZU IHRER BILDUNG |
摘要 |
An electrical structure and method of forming. The electrical structure includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad. |
申请公布号 |
AT528796(T) |
申请公布日期 |
2011.10.15 |
申请号 |
AT20080718206T |
申请日期 |
2008.03.26 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BUCHWALTER, STEPHEN;FURMAN, BRUCE;GRUBER, PETER;NAH, JAE-WOONG;SHIH, DA-YUAN |
分类号 |
H01L23/00 |
主分类号 |
H01L23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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