发明名称 |
Method and device for encapsulating electronic components using a reduction material which undergoes a phase change |
摘要 |
The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) placing an electronic component for encapsulating into a mould cavity connecting to the carrier, B) filling the mould cavity with liquid encapsulating material, and C) at least partially curing the encapsulating material in the mould cavity A reduction material is introduced during processing step B). Said material undergoes a phase change during processing step B) whereby the volume of the reduction material decreases. The invention also relates to a device for applying this method. |
申请公布号 |
GB2516148(B) |
申请公布日期 |
2016.10.26 |
申请号 |
GB20140007324 |
申请日期 |
2012.10.18 |
申请人 |
Besi Netherlands B.V. |
发明人 |
Joannes Leonardus Jurrian Zijl;Wilhelmus Gerardus Jozef Gal |
分类号 |
B29C45/14;B29C45/02;B29C45/17;H01L21/56 |
主分类号 |
B29C45/14 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|