| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for peeling a heat-resistant organic polymer layer from a substrate, such as a glass substrate, easily and sufficiently, without using laser.SOLUTION: In a peeling method of a heat-resistant organic polymer layer performing the peeling on the interface of a substrate and the heat-resistant organic polymer layer by irradiating a laminate, having at least one heat-resistant organic polymer layer formed on the substrate, with a light beam of continuous wide wavelength range, a heat-resistant organic polymer layer A containing a filler having a photothermal conversion capability is formed in contact with the substrate, in the laminate.SELECTED DRAWING: None |
