| 摘要 |
PROBLEM TO BE SOLVED: To improve connection reliability at the spots, where the bump electrodes of a semiconductor device are brought into contact with the electrodes of a wiring board by providing guide layers which regulate the positions of the bump electrodes around the electrodes of the wiring board. SOLUTION: Each upper electrode 4 connected with a bump electrode (Au ball) 3 is surrounded by a guide layer 6 formed of an insulating material on the main surface of a package substrate 1. The guide layer 6 is formed by applying a solder resist used for protecting wiring formed on the main surface of the substrate 1 into a thick film, but the layer 6 is not limited to this and may be formed by sticking a synthetic resin film to the main surface of the substrate 1. On the lower surface of the substrate, lower electrodes 7 connected electrically to the upper electrodes 4 through wiring and through holes are formed. Guide layers 6 correct the positional deviations between the Au balls 3 and the upper electrodes 4. |
