| 摘要 |
<P>PROBLEM TO BE SOLVED: To manufacture a metallized ceramic substrate without the problem of interlayer peeling and having excellent hermeticity and electric conductivity. <P>SOLUTION: This metallized ceramic substrate (100) has a ceramic base (10), a wiring pattern (20) formed on one surface thereof, and a lead (30) electrically connected to the wiring pattern. The ceramic base has a through-hole (40). The lead passes through the through-hole and is led out to the other surface side, and the lead is fixed by filling an electrically conductive filler (50) into the gap between the lead and the inner surface of the through-hole to maintain the hermeticity. <P>COPYRIGHT: (C)2007,JPO&INPIT |
