发明名称 |
CONFIGURABLE POLISHING APPARATUS |
摘要 |
A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.
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申请公布号 |
US2008051014(A1) |
申请公布日期 |
2008.02.28 |
申请号 |
US20070762007 |
申请日期 |
2007.06.12 |
申请人 |
JEONG IN-KWON;BERKSTRESSER DAVID E |
发明人 |
JEONG IN-KWON;BERKSTRESSER DAVID E. |
分类号 |
B24B7/30;B24B1/00;B24B7/19 |
主分类号 |
B24B7/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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