SYSTEM AND METHOD FOR ELECTROPLATING OF HOLE SURFACES

摘要

An electroplating method for plating internal surfaces of holes in metal products uses a needle anode associated with an XYZ or multi-direction positioning device to position the needle such that an insertion portion of the needle anode is centered over a hole and inserted to a predetermined depth in the hole, with a discharge end located a predetermined distance from the inner end of the hole. Plating solution is supplied to the needle anode and flows continuously during plating from the discharge end of the needle, through a gap between the needle anode and inner surface of the hole, and out of the open end of the hole into a drain. In one example, the metal object is a terminal of an electrical connector and the hole is a solder cup at a terminal end of the connector.

主权项

1. A method of electroplating an interior surface of a hole in a workpiece, comprising:
supporting a workpiece having at least one hole to be plated beneath a plating system including a tubular electrode of conductive material having at least an insertion portion extending to a discharge end of the tubular electrode which is of cross-sectional dimensions less than the cross-sectional dimensions of the hole to be plated, at least part of the workpiece including the hole being of conductive metal; moving the tubular electrode relative to the workpiece to a predetermined horizontal position spaced above and centered on the hole; moving the tubular electrode vertically relative to the hole into a plating position in which the insertion portion extends into the hole with the discharge outlet spaced a predetermined distance above an inner end of the hole; connecting a power supply between the tubular electrode and conductive metal of the workpiece, whereby the inserted portion of the tubular electrode and the internal surface of the hole comprise electroplating electrodes; connecting an inlet end of the tubular electrode to a supply of plating solution to direct a flow of plating solution through the tubular electrode, out of the discharge outlet, between the anode and interior surface of the hole, and out of an open end of the hole, whereby metal is deposited from the flow of plating solution onto the interior surface of the hole and the plating solution flow is continuous during a predetermined hole plating procedure; and collecting spent plating solution flowing out of the open end of the hole in a collection device spaced below the plating system during hole plating, and directing the spent plating solution along a discharge flow path away from the workpiece and tubular electrode.