COVER MATERIAL FOR HERMETIC SEALING AND ELECTRONIC COMPONENT-CONTAINING PACKAGE

摘要

This cover material for hermetic sealing (1) is formed of a cladding material (10) that is provided with: a base layer (11) which is formed of an Fe alloy containing 4% by mass or more of Cr; and a silver brazing material layer (13) which is bonded to the electronic component-containing member-side surface of the base layer, with an intermediate layer (12) being interposed therebetween.