发明名称 |
PROTECTIVE FILM-FORMING FILM, SHEET FOR PROTECTIVE FILM, COMPLEX SHEET FOR FORMING PROTECTIVE FILM, AND METHOD OF PRODUCING MANUFACTURED PRODUCT |
摘要 |
Provided is protective film-forming sheet (2) including: a protective film-forming film (1) having a light transmittance at a wavelength of 1064 nm of 55% or greater and a light transmittance at a wavelength of 550 nm of 20% or less; and a release sheet (21) which is laminated on one or both faces of the protective film-forming film (1). According to this protective film-forming sheet (2), it is possible to form a protective film which allows a workpiece such as a semiconductor wafer to have a modified layer disposed in advance therein by a laser so that the workpiece can be split through the application of force thereon, while preventing grinding marks on the workpiece or a product formed therefrom from being visible to the naked eye. |
申请公布号 |
SG11201606008W(A) |
申请公布日期 |
2016.08.30 |
申请号 |
SG11201606008W |
申请日期 |
2015.01.21 |
申请人 |
LINTEC CORPORATION |
发明人 |
YAMAMOTO, DAISUKE;YONEYAMA, HIROYUKI |
分类号 |
H01L21/02;C09J7/02;H01L21/301 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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