| 摘要 |
The present invention relates to a two-component composition comprising a first component and a second component, wherein the first component being a pre-accelerated resin composition comprising an unsaturated polyester resin or vinyl ester resin and a copper2+ compound, at least one N-containing organic base selected from an amine compound and/or an ammonium salt; and wherein copper is present in an amount of at least 50 ppm (relative to the primary resin system), wherein the resin composition contains less than 0.01 mmol cobalt per kg primary resin system, the resin composition has an acid value in the range of from 0.001-300 mg KOH/g of resin composition, the molecular weight of the resin containing reactive unsaturations is in the range of from 500 to 200,000 g/mole and wherein the second component comprises a peroxide compound. |
| 主权项 |
1. A two-component composition comprising a first component and a second component, wherein
the first component is a pre-accelerated resin composition having an acid value in the range of from 0.001-300 mg KOH/g of resin composition, the resin composition comprising (i) an unsaturated polyester resin having a molecular weight in a range of 500 to 200,000 g/mole, (ii) an accelerator consisting essentially of a copper2+ compound in an amount of least 50 ppm, based on the primary resin system, and (iii) at least one N-containing organic base selected from an amine compound and/or an ammonium salt; wherein the amine compound has the following formula: and the ammonium salt has the following formula:
R1R2R3N+Hwhereby R1, R2 and R3 each individually may represent hydrogen (H), C1-C20 alkyl, C5-C20 cycloalkyl or C7-C20 alkylaryl, that each optionally may contain one or more hetero-atoms and/or substituents and a ring may be present between R1 and R2, R2 and R3 and/or R1 and R3, which may contain heteroatoms, wherein the second component comprises a peroxide compound, and wherein the two-component composition contains less than 0.01 mmol cobalt per kg primary resin system, and wherein a molar ratio between the copper and basic functionality of the base is from 40:1 to 1:125. |
