发明名称 SWITCHED INTERFACE STACKED-DIE MEMORY ARCHITECTURE
摘要 Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated.
申请公布号 US2016260503(A1) 申请公布日期 2016.09.08
申请号 US201615155848 申请日期 2016.05.16
申请人 Micron Technology, Inc. 发明人 Jeddeloh Joe M.;LaBerge Paul A.
分类号 G11C29/00;G11C5/02;G11C8/10;G11C7/10 主分类号 G11C29/00
代理机构 代理人
主权项 1. An apparatus, comprising: a memory vault comprising a stacked plurality of memory arrays, each memory array of the stacked plurality of memory arrays located on a memory die of a plurality of stacked memory dies; a memory vault controller (MVC) communicatively coupled to the memory vault; and a memory vault repair logic (MVRL) component of the MVC, the MVRL to receive a memory request including a requested memory address, the MVRL including at least one lookup table to translate the requested memory address into a repair address, and the MVRL and to send one or both of the memory request and the repair address to the memory vault.
地址 Boise ID US