发明名称 |
SWITCHED INTERFACE STACKED-DIE MEMORY ARCHITECTURE |
摘要 |
Systems and methods disclosed herein include those that may receive a memory request including a requested memory address and may send the memory request directly to an address decoder associated with a stacked-die memory vault without knowing whether a repair address is required. If a subsequent analysis of the memory request shows that a repair address is required, an in-process decode of the requested memory address can be halted and decoding of the repair address initiated. |
申请公布号 |
US2016260503(A1) |
申请公布日期 |
2016.09.08 |
申请号 |
US201615155848 |
申请日期 |
2016.05.16 |
申请人 |
Micron Technology, Inc. |
发明人 |
Jeddeloh Joe M.;LaBerge Paul A. |
分类号 |
G11C29/00;G11C5/02;G11C8/10;G11C7/10 |
主分类号 |
G11C29/00 |
代理机构 |
|
代理人 |
|
主权项 |
1. An apparatus, comprising:
a memory vault comprising a stacked plurality of memory arrays, each memory array of the stacked plurality of memory arrays located on a memory die of a plurality of stacked memory dies; a memory vault controller (MVC) communicatively coupled to the memory vault; and a memory vault repair logic (MVRL) component of the MVC, the MVRL to receive a memory request including a requested memory address, the MVRL including at least one lookup table to translate the requested memory address into a repair address, and the MVRL and to send one or both of the memory request and the repair address to the memory vault. |
地址 |
Boise ID US |